CommScope and US Conec have reached a licensing agreement that enables both parties to manufacture VSFF (Very Small Form Factor) fiber connectors including the MDC connector and beyond.
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MDC connector (Photo: Business Wire)
For over two decades, duplex fiber optic connectors supporting in-building networks, datacenter, and carrier-based applications have utilized SC or LC formats, with LC connectors providing double the number of connections as the SC connector in the same amount of space. With the ever-increasing demand on data centers and carrier-based applications, emerging architectures require the higher connectivity densities offered by US Conec’s MDC connector.
The MDC connector is the next step in connector technology, allowing data centers and carrier-based applications to prepare for the network demands of the future. The MDC duplex connector enables the highest achievable connector density by delivering a 3X advantage over a standard LC connector. Manufactured with 1.25mm ferrule technology, it is designed to support even the most challenging applications such as high density data center cabling infrastructure and 400G+ breakout transceiver designs.
“The MDC duplex connector ushers in a new era of dual fiber connectivity by delivering unmatched density, simple insertion/extraction, field configurability and optimal carrier grade performance,” said Joe Graham, President of US Conec. “The collaborative effort between US Conec and CommScope opens the door to rapid high-volume deployments with leading edge connector technology to ensure robust supply chain demands are met.”
Jamie Birdnow, VP of Market Development and Advance Core Technologies at CommScope, added: “This new, high density connector format and multi-source agreement with US Conec will enable greater opportunity for innovation by providing a new platform for future connectivity solutions.”
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