Nokia Siemens Networks and Qualcomm will use next week’s Mobile World Congress in Barcelona to demonstrate HSPA+ Multiflow, a feature they claim will offer doubled data speeds for users at the edge of mobile phone cells.
HSPA+ (high-speed packet access) Multiflow works by connecting a device close to the fringes of a mobile base station’s reach to a second base station to boost reliability and speed.
Nokia Siemens claims that by allowing devices to connect to more than one base station at a time, the new technology will offer up to 50 per cent faster response times compared to existing networks, as well as greater efficiency for network resources.
HSPA+ Multiflow will be demonstrated at the MWC event using a prototype Qualcomm USB dongle and Nokia Siemens’ commercial base stations, and is expected to be standardised by the 3GPP by mid-2012.
“We are working with Nokia Siemens Networks to drive the evolution and deployment of technologies like HSPA+,” Serge Willenegger, vice president of product management at Qualcomm, said in a statement. “This demonstration confirms that HSPA+ Multiflow will enable us to further enhance the HSPA+ mobile broadband user experience, and is thus a valuable contribution toward enhancing the HSPA+ value proposition and further expanding global mobile broadband coverage.”
Nokia Siemens also announced that HSPA+ Multiflow will be available commercially from 2013, though there will be network software and consumer hardware upgrades to tackle first.
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