Press release

Teledyne Scientific Presenting Three New Papers Next Week at International Microwave Symposium 2019

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Next week at the annual International Microwave Symposium (IMS) trade
show in Boston, Teledyne Scientific staff will be taking part in three
of the Technical Sessions being held on Thursday, June 6. The three
Teledyne Scientific staff people presenting technical papers at the
sessions will be Keisuke Shinohara, Principal Scientist, Zach Griffith,
mm-wave and THz Design and Product Engineer, and Andrea Arias, Senior RF
Engineer.

These papers showcase Teledyne’s leadership in linear broadband
millimeter-Wave amplifiers with high efficiency. Teledyne
Scientific will also be present during the show at the Teledyne
Defense Electronics
(TDE), Booth #1124 where they will be featuring
their mmWave InP power amplifiers which deliver some of the highest
bandwidth and efficiency from 30 to 300 GHz.

Dr. Shinohara will be presenting first during the technical session
entitled “Emerging mm-Wave Transistor Technologies for 5G and DoD
Applications.”

  • Paper being presented:
    “GaN-Based Multi-Channel
    Transistors with Lateral Gate for Linear and Efficient Millimeter-Wave
    Power Amplifiers.”
  • Authors:
    K. Shinohara, C. King, E.J. Regan, Josh Bergman,
    Andrew D. Carter, Andrea Arias, Miguel Urteaga, Bobby Brar, R. Page,
    R. Chaudhuri, M. Islam, H. Xing, D. Jena
  • Time: 9:00 to 9:20 am, Thursday, June 6
  • Session: Th1F-4 Place: 254AB

Dr. Griffith will be presenting next during the technical session
entitled “mm-Wave and THz Power Amplifiers.”

  • Paper being presented:
    “A 140-GHz 0.25-W PA and a
    55–135GHz 115–135mW PA: High-Gain, Broadband Power Amplifier MMICs in
    250-nm InP HBT”
  • Authors:
    Zach Griffith, Miguel Urteaga, Petra Rowell
  • Time: 10:10 to 10:30 am, Thursday, June 6
  • Session: Th2D-1 Place: 157BC

Ms. Arias will make the final presentation during the session entitled “Advances
in CMOS, and HBT Technologies for Monolithic ICs.”

  • Paper being presented:
    “185mW InP HBT Power Amplifier
    with 1 Octave Bandwidth (25-50GHz), 38% Peak PAE at 44 GHz and Chip
    Area of 276×672µm²”
  • Authors:
    Andrea Arias, Petra Rowell, Miguel Urteaga, Zach
    Griffith, K. Shinohara, Josh Bergman, Andrew D. Carter, Richard
    Pierson, Bobby Brar, James F. Buckwalter, Mark J.W. Rodwell
  • Time: 11:30 to 11:50 am, Thursday, June 6
  • Session: Th2F-6 Place: 254AB

To learn more about the presentations and read Abstracts of the papers
being presented, visit the IMS website section on Technical
Sessions
.

In addition to Teledyne Scientific, other Teledyne companies
participating in TDE Booth #1124 include Teledyne
e2v Semiconductors
, Teledyne
e2v RF Power — Defence
, Teledyne
Labtech
, Teledyne
Microwave Solutions
(RF & Microwave Products), Teledyne
MEC
(TWT Products), Teledyne
Relays
/ Teledyne Coax Switches and Teledyne
Storm Microwave
.

About Teledyne Defense Electronics

Serving Defense, Space and Commercial sectors worldwide, Teledyne
Defense Electronics offers a comprehensive portfolio of highly
engineered solutions that meet your most demanding requirements in the
harshest environments. Manufacturing both custom and off-the-shelf
product offerings, our diverse product lines meet emerging needs for key
applications for avionics, energetics, electronic warfare, missiles,
radar, satcom, space, and test and measurement . www.teledynedefelec.com.
TDE is a business unit of Teledyne Technologies, Inc., a leading
provider of sophisticated instrumentation, digital imaging products and
software, aerospace and defense electronics, and engineered systems. www.teledyne.com