Press release

Saki Corporation Introduces Ultra-fast, Inline, 2D Bottom-side Automated Optical Inspection for PCBs

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, an innovator in the field of automated optical and
x-ray inspection and measurement equipment, announces the release of its
new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system
at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany.

German translation:

Saki’s 2D line-scan technology is ultra-fast, capturing the image of an
entire 460x500mm printed circuit board assembly (PCBA) and carriers of
610x610mm in one pass, in real time, storing the image into memory, and
creating inspection data for the entire board. This versatile system
automates the bottom-side inspection process, eliminates board flipping
and handling, and ensures quality after the potting, dip, wave, and
selective soldering processes.

The 2Di-LU1 software includes Saki’s proprietary Fujiyama algorithm,
which provides complete through-hole joint inspection in a single step.
It simultaneously inspects for copper exposure, pin detection,
pin-holes, solder fillet abnormalities, missing components, soldering
problems, and bridges. Saki’s inspection software has been used for
extra component detection of solder balls and foreign objects and
through-hole device inspection in the automotive industry for several
years and complies with the IPC-A-610 standard.

“Incorporating bottom-side AOI into the assembly process increases
productivity by reducing the time, costs, labor, and floorspace needed
for manual inspection, additional conveyors, or equipment to flip the
board,” explained Yoshihiro Akiyama, chief technical officer, Saki
Corporation. “Saki’s system speeds the inspection process, increases
throughput, and eliminates extra PCBA handling and the risk of substrate

The platform and construction of the 2Di-LU1 bottom-side AOI system is
based on Saki’s rigid, time-tested hardware that ensures very stable
machine performance and long hardware life. The system supports L-size
PCBs, high clearances, heavy substrates, and mounted jigs.

Saki will feature its 2D bottom-side AOI system, along with its 3D AOI,
SPI, and AXI systems and Saki Self-Programming Software, at NEPCON
China, Shanghai, China, in the Saki booth 1J30 and the Fuji booth 1G60,
being held April 24-26 and at SMTconnect, Nuremberg, Germany, in Hall
4A133, being held May 7-9.

For more information contact Saki at
or visit our website at

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About Saki Corporation

Since its inception in 1994, Saki has led the way in the development of
automated recognition through robotic vision technology. Saki’s 3D
automated solder paste, optical, and x-ray inspection systems (SPI, AOI,
AXI) have been recognized to provide the stable platform and advanced
data capture mechanisms necessary for true M2M communication, improving
production, process efficiency, and product quality. Saki Corporation
has headquarters in Tokyo, Japan, with offices, sales, and support
centers around the world.