The Linley Group today announced an exceptional lineup of technical
talks by industry experts at the second annual Linley
Spring Processor Conference taking place April 10-11, 2019, at the
Hyatt Regency in Santa Clara, CA. This unique forum brings together
world-class innovators developing the latest processors, memory, and IP
cores used in AI, embedded, communications, IoT, and server designs.
Featured keynotes include:
-
Jon Masters, Computer Architect at Red Hat, will present “After
Meltdown and Spectre: Security Concerns Facing Contemporary
Microarchitectures.” -
Linley Gwennap, Principal Analyst at The Linley Group, will discuss
the latest trends in AI accelerators in “A Deep Dive Into Deep
Learning.”
The conference will showcase product and technology disclosures in these
technical sessions:
-
AI in Data Center – Deep neural networks (AI) are being broadly
deployed to support increasingly complex services such as voice
interfaces, image searches, content filtering, and data mining. This
session will discuss how server designers can improve the processing,
memory, and I/O capabilities of their systems to address these
changing workloads. -
IoT Security – Recent breaches in the Internet of Things have
shown that strong security can’t be an afterthought but must be
incorporated into designs from the start. This session will discuss
technologies and industry initiatives that resist attacks from
multiple vectors. -
CPU Cores – RISC-V is gaining ground in the CPU-core market
while Arm remains the leading supplier of CPU cores for client devices
and microcontrollers. This session highlights these two approaches and
contrasts the capabilities of these CPU vendors. -
AI at the Edge – AI is moving out of data centers and into edge
devices including automobiles, security cameras, IoT devices, and
smartphones. This session will examine challenges in edge-AI as well
as the licensable cores available to accelerate deep learning. -
DSP Cores – Automotive lidars and radars produce signals that
are very different than cellular radios. This session will describe
two new DSP cores that can handle complex signal-processing tasks in
automotive, IoT, and other challenging applications. -
SoC Design – Combining many types of cores on a single chip
presents many SoC-implementation challenges, but employing a
network-on-chip (NoC) can ease integration, as can use of configurable
silicon-proven cores. This session will discuss the benefits of NoC
tools and design platforms for complex chips.
Presenting companies include Arm, Intel, Flex Logix, Arteris IP,
Cadence, Synopsys, Ceva, Inside Secure, Micron, Andes Technology, Wave
Computing, SiFive, eSilicon, and Rambus.
Attendees will have an opportunity to network with industry leaders and
visit sponsor exhibits during the cocktail reception on Wednesday, April
10 immediately following the presentations. The Linley Group offers free
admission to qualified registrants who sign up by April 4. For the full
conference program and to register, please visit www.linleygroup.com/SPC19.
About The Linley Group
The Linley Group is the industry’s leading source for independent
technology analysis of semiconductors for a broad range of applications
including networking, communications, data-center applications, mobile,
and embedded. The company provides strategic consulting services,
in-depth analytical reports, and conferences focused on advanced
technologies for chip and system design. The Linley Group is the
publisher of the noted Microprocessor
Report, a weekly publication. For insights on recent industry news,
subscribe to the company’s free email newsletter: Linley
Newsletter.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190328005165/en/