Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”,
“K&S” or the “Company”), announced today that it will be participating
at the SEMICON Southeast Asia (SEA) 2019 trade show at MITEC in Kuala
Lumpur, Malaysia, from May 7 through 9, 2019.
Kulicke & Soffa’s Hybrid equipment will be featured at the SMART
Manufacturing pavilion along with other equipment forming the
manufacturing transformation from wafer processing to electronics
packaging. In collaboration with a third party, there will be an
Augmented Reality (AR) demonstration on K&S’s Wedge Bonder bondhead
visual maintenance process.
Chan Pin Chong, Kulicke & Soffa’s Senior Vice President for EA/APMR &
Wedge Bonder Business Units, said, “K&S is continuing to partner with
suppliers that can provide closed loop process monitoring. Closed loop
feedback provides real time adjustments to the complex processes in a
smart factory to ensure delivery of products of the highest quality.
Similarly, augmented reality (AR) is likely to become more pervasive in
manufacturing as a tool to support the complex assembly lines and
enhance user experience.”
Chan Pin will deliver a presentation on the Smart Backend Assembly
Factory for Industry 4.0 as well as High Accuracy Surface Mount
Technologies Capability for Advanced Packaging Embedded Technologies at
the Advanced Packaging Technical Forum on May 8, 2019, organized by SEMI
Customers could visit K&S’s hospitality booth #602 to discuss more on
its full range of assembly solutions.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)