Intevac, Inc. (Nasdaq: IVAC), a leading supplier of thin-film processing
systems, today announced it has closed an agreement with a leading
display cover glass manufacturer to place its newest system, the VERTEX
Spectra™, for evaluation at their facility. Scheduled to ship in June,
this system is configured to process unique and differentiated
decorative coatings, targeted initially for back cover applications on
next-generation handset models.
“After driving our internal strategy to place seed VERTEX assets into
the field for several quarters, we are very pleased to announce that our
newest system, the VERTEX Spectra, is now scheduled to be installed at a
leading display cover glass manufacturer,” commented Wendell Blonigan,
president and chief executive officer of Intevac. “This evaluation
system enables regional accessibility to Intevac’s technology, and will
support the fast design turns required to meet smartphone OEMs’
aggressive product development cycles. The versatile VERTEX Spectra
system enables new, differentiated, and fully-integrated film stack
configurations that will expand the freedom and options available in the
design of next-generation smartphones.”
Equipped with Intevac’s proprietary Ion Beam Assisted Deposition (IBAD)
and Ion Beam Etching (IBE) technologies, the VERTEX Spectra deposits
decorative coatings with unique patterning effects for smartphone glass
back covers. The IBAD technology can also be used to deposit hard
optical anti-reflective (AR) coatings that are highly resistant to
scratching and abrasion.
About VERTEX SpectraTM
Intevac’s VERTEX SpectraTM is an extension of the VERTEX
oDLC® system, which provides cost-effective solutions for the growing
demand for hard anti-reflective (AR) and unique patterned decorative
coatings for smartphone cover glass. The VERTEX Spectra enables the
incorporation of multiple technologies on a single system, including
Intevac’s proprietary Ion Beam Assisted Deposition (IBAD) and Ion Beam
Etch (IBE) technologies, as well as the Physical Vapor Deposition (PVD)
technology used to deposit the company’s oDLC protective film. Designed
for volume manufacturing, the VERTEX Spectra utilizes a modular design
to minimize factory floor footprint while protecting operator investment
with future process scalability and high target utilization.
About Intevac
Intevac was founded in 1991 and has two businesses: Thin-film Equipment
and Photonics.
In our Thin-film Equipment business, we are a leader in the design and
development of high-productivity, thin-film processing systems. Our
production-proven platforms are designed for high-volume manufacturing
of substrates with precise thin film properties, such as the hard drive
media, display cover panel, and solar photovoltaic markets we serve
currently.
In our Photonics business, we are a recognized leading developer of
advanced high-sensitivity digital sensors, cameras and systems that
primarily serve the defense industry. We are the provider of integrated
digital imaging systems for most U.S. military night vision programs.
For more information, call 408-986-9888 or visit the company’s website
at www.intevac.com.
INTEVAC VERTEX®, VERTEX SpectraTM and oDLC® are
trademarks of Intevac, Inc.
Forward-Looking Statements
This press release includes statements that constitute “forward-looking
statements” within the meaning of the Private Securities Litigation
Reform Act of 1995 (the “Reform Act”). Intevac claims the protection of
the safe-harbor for forward-looking statements contained in the Reform
Act. These forward-looking statements are often characterized by the
terms “may,” “believes,” “projects,” “expects,” or “anticipates,” and do
not reflect historical facts. Specific forward-looking statements
contained in this press release include, but are not limited to; the
timing of the VERTEX shipment and the films processed. The
forward-looking statements contained herein involve risks and
uncertainties that could cause actual results to differ materially from
the company’s expectations. These risks include, but are not limited to:
the failure to meet planned shipment and customer acceptance dates,
which could have a material impact on our business, our financial
results, and the company’s stock price. These risks and other factors
are detailed in the Company’s periodic filings with the U.S. Securities
and Exchange Commission.
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