Corporation (NASDAQ: CYBE), a leading global developer and
manufacturer of high-precision 3D sensing technology solutions, will
exhibit at SEMICON West, July 9-11, 2019 in booth #5769 at the Moscone
Center in San Francisco, CA. During the show, the company will launch
its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3)
with CyberSpectrum software. Semiconductor fabs and OEMs value the
accuracy, precision and versatility of the WaferSense AVLS3 – The most
efficient and effective wireless measurement device for leveling and
This press release features multimedia. View the full release here:
WaferSense(R) AVLS3 with New CyberSpectrum Software (Photo: CyberOptics)
At only 3.5mm, AVLS3 can travel with ease to most fab locations where a
wafer travels. The Chemically Hardened Glass (CHG) substrate enables
smooth wafer handling and improved vacuum chucking.
With long-range wireless capability, AVLS3 combined with new,
easy-to-use CyberSpectrum software, collects and displays both leveling
and vibration data simultaneously for fast equipment set-up, alignment
and real-time equipment diagnostics.
“Engineers In the front-end of the fab can speed equipment
qualification, shorten equipment maintenance cycles, lower equipment
maintenance expenses and enhance process uniformity,” said Dr. Subodh
Kulkarni, President and CEO, CyberOptics Corporation, “As with other
WaferSense devices widely used across fabs world-wide, AVLS3 can
significantly improve yields and tool uptime.”
Additionally, for mid-end and advanced packaging inspection and
measurement, CyberOptics will demonstrate the new proprietary
NanoResolution Multi-Reflection Suppression (MRS)
sensor technology that meticulously identifies and rejects multiple
reflections caused by shiny components and mirror-like surfaces.
Effective suppression of multiple reflections is critical for highly
Offering an unparalleled combination of high accuracy, high resolution
and speed, MRS sensors are widely used for inspection and measurement in
the SMT, semiconductor and metrology markets. The new 3-micron
NanoResolution MRS sensor enables metrology grade accuracy with superior
100% 2D and 3D inspection performance for features as small as 25-micron.
Further, it is two to three times faster than alternate solutions in the
marketplace. With data processing speeds in excess of 75 million 3D
points per second, the NanoResolution MRS sensor delivers throughput
greater than 25 wafers (300mm) per hour. 100% 2D and 3D inspection can
be completed simultaneously at high speed, versus an alternate, slow
method that requires two separate scans for 2D and 3D, and only a
sampling of a few dies of the 25 wafers.
This best-in-class MRS sensor technology is ideally suited for the
inspection of CPU sockets, IC package, solder balls and bumps, copper
pillars, and other advanced packaging and mid-end semiconductor
applications where high precision and speed are needed.
For more information, visit www.cyberoptics.com.
CyberOptics Corporation (www.cyberoptics.com)
is a leading global developer and manufacturer of high precision sensing
technology solutions. CyberOptics’ sensors are used in SMT,
semiconductor and metrology markets to significantly improve yields and
productivity. By leveraging its leading edge technologies, the company
has strategically established itself as a global leader in high
precision 3D sensors, allowing CyberOptics to further increase its
penetration of key vertical markets. Headquartered in Minneapolis,
Minnesota, CyberOptics conducts worldwide operations through its
facilities in North America, Asia and Europe.
Statements regarding the company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties, including
but not limited to: market conditions in the global SMT and
semiconductor capital equipment industries; the timing of orders and
shipments of our products, particularly our 3D MRS-enabled AOI systems;
increasing price competition and price pressure on our product sales,
particularly our SMT systems; the level of orders from our OEM
customers; the availability of parts required to meet customer orders;
unanticipated product development challenges; the effect of world events
on our sales, the majority of which are from foreign customers; rapid
changes in technology in the electronics and semiconductor markets;
product introductions and pricing by our competitors; the success of our
3D technology initiatives; the market acceptance of our SQ3000 3D CMM
system, products for semiconductor mid-end and advanced packaging
inspection applications and CyberGage360 product; costly and time
consuming litigation with third parties related to intellectual property
infringement; and other factors set forth in the company’s filings with
the Securities and Exchange Commission.