Samsung is now mass producing its embedded package on package (ePoP) memory for smartphones. ePoPs are single memory packages that are made up of dynamic RAM (DRAM), an embedded multi-media card (eMMC), and a controller.
Samsung said that by using ePoP, it can build better designed phones with increased multitasking abilities. The South Korean firm started using ePoP last year in its wearable devices range.
Samsung’s memory SVP Jeeho Baek said: “By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features.
Samsung plans to use ePoP in its high-end smartphones, and said that the components can be stacked directly on top of the mobile processor, without taking any additional space – a “distinct improvement over existing two-package eMCP memory solutions”.
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