Leaked specifications suggest Google’s next Nexus will pack some serious grunt
More details about the next flagship Google’s Nexus smartphone, reportedly manufactured by Huawei, have been leaked by noted online tipster Evan Blass, better known as @evleaks, who suggests the new device will boast some seriously impressive power.
Little is known yet about the Snapdragon 820, which should be the brains behind many of 2016’s top smartphones and tablets.
Qualcomm revealed in January that the new chip would begin sampling later this year, and will have its own built-in LTE modem as well as a custom-designed Qualcomm processor and graphics core.
The new Nexus will also pack a fingerprint reader, making it a poster child for Google’s upcoming Android Pay technology, and will be the first time we’ll get a look at Google’s Android M operating software in the wild.
Other reported specs include a 5.7-inch screen with a QHD 1440 x 2560 display, and built with an all-metal body. Blass says that the device will ship in Q4 2015, meaning we should hear some concrete information about it from Google soon.
Previous Nexus devices, which serve as flagships for new Android features, have been manufactured by the likes of Samsung and Motorola.
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